Ultrafast femtosecond laser cutting machine has pushed precision manufacturing to an unprecedented height. First of all, the femtosecond laser cutting machine has submicron-level precision, and the incision width can be precisely controlled within a few microns to more than ten microns, easily realizing complex cell-level microstructures such as precise mesh of vascular stents and cantilever beams of MEMS sensors.

 

The optical-grade surface finish of the laser cutting machine eliminates the need for secondary polishing for most workpieces, and can directly meet the stringent requirements of optical components, chip substrates, etc. for surface quality.

 

In addition, the femtosecond laser cutting machine has three-dimensional precision processing capabilities. Through precise focus control, it can selectively modify and cut inside transparent materials (such as optical glass and sapphire cover plates), or directly carve complex functional structures such as microchannels, photonic crystals, and diffraction gratings on the surface or inside of the material. It is widely used in industries such as high-end medical device manufacturing, semiconductors and integrated circuits, precision optoelectronics, and display technology.

 

The femtosecond laser cutting machine is not only the evolution of a tool, but also represents a revolutionary leap in manufacturing concepts. With ultra-high precision and minimal intervention on materials, it solves the core contradiction that cannot be overcome by traditional means - achieving the ultimate goal of "extreme precision, perfect surface, and no material loss" at the same time on a microscopic scale. Its value is irreplaceable in improving the performance limit, reliability and production yield of cutting-edge products.