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Precision Laser Cutting Machine for Hard Brittle Materials
Basic Info
Model No.: BHLC6045
Application: Laser Cutting
Applied Material: Acrylic, Glass, Leather, Mdf, Metal, Paper, Plastic, Plexiglax, Plywood, Rubber, Stone, Wood, Crystal
Old And New: New
Laser Type: Fiber Laser
Cutting Area: Other
Support Graphic Format: Dxf, Dwg
Whether CNC: Yes
Cooling Method: Water Cooling
Place Of Origin: China
Certification: Ce, Ccc
Additional Info
Transportation: Ocean,Land,Air
Port: Shanghai Port,Shandong Port,Guangzhou Port
Product Description
Hard and brittle material laser cutting machines are primarily used for precision laser cutting, drilling, marking, and grooving of highly brittle and hard materials, such as ceramics (zirconia, alumina), glass, sapphire, diamond, tungsten steel, quartz, and silicon wafers. Utilizing non-contact laser processing and ultra-short pulse technology, these cutting machines effectively reduce thermal stress and microcracks during processing, ensuring smooth cutting surfaces and preserving the structural integrity of brittle materials.
Advantages of Hard and Brittle Material Laser Cutting Machines
Non-contact laser processing eliminates mechanical stress and minimizes thermal impact, avoiding material cracking, delamination, discoloration, and other quality issues while retaining the material’s original properties.
Achieves micron-level precision, supporting complex patterns, micro-hole drilling, and fine contour processing.
Ideal for heat-sensitive materials like optical glass and semiconductor wafers.
Offers customizable configurations: dual workstations, visual positioning, automatic loading/unloading systems, real-time processing monitoring, movable tension frame & fixed tension frame, vacuum adsorption, and more.
Features ergonomic design with a sleek, user-friendly interface for simplified operation.
Parameters of Hard and Brittle Material Laser Cutting Machines
Applications of Hard and Brittle Material Laser Cutting Machines
Widely used in laser micromachining for:
Smartphone display cover glass, camera green filter lenses, optical prisms.
Microfluidic channels on quartz substrates, optical glass, semiconductor wafers.
Solar cells, surgical blades, chips, ceramic seals, tungsten carbide tools
Sapphire watch covers, brittle sensor components, LED substrates, and insulation parts for new energy vehicle batteries.
Key industries: electronics/optics, semiconductors, medical devices, aerospace, and industrial components.
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Product Categories : Precision Laser Cutting Machine
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