Copper and aluminum substrate laser cutting machine

Basic Info

Model No.: BBLC12560

Application: Laser Cutting

Applied Material: Acrylic, Glass, Leather, Mdf, Metal, Paper, Plastic, Plexiglax, Plywood, Rubber, Stone, Wood, Crystal

Old And New: New

Laser Type: Fiber Laser

Cutting Area: 1000mm*2000mm

Support Graphic Format: Dxf, Dwg

Whether CNC: Yes

Cooling Method: Water Cooling

Place Of Origin: China

Certification: Ce, Ccc

Additional Info

Transportation: Ocean,Land,Air

Port: Shanghai Port,Shandong Port,Guangzhou Port

Product Description

Copper aluminum substrate laser cutting machines are specifically designed for high-precision cutting of metal circuit boards. They are primarily used for precision cutting of copperaluminum substrates, PCB circuit boards, and ceramic circuit boards with thicknesses ranging from 2-6mm. By integrating fiber lasers and high-precision CNC systems, these machines enable efficient, non-contact cutting with smooth, burr-free edges and minimal deformation, meeting the high-precision, high-quality processing demands of industries such as electronics, hardware, and LED.

Advantages of Copper/Aluminum Substrate Laser Cutting Machines

Next-generation laser technology with high-brightness anti-back reflection design enhances processing efficiency for highly reflective materials like copper and aluminum.

High repeat positioning accuracy, equipped with a high-resolution CCD positioning system and linear guides, ensures smooth, flat edges without mechanical stress.

Capable of precision processes including laser cutting, drilling, marking, and grooving for PCB substrates.

Optional features: dual workstations, visual positioning, automated loading/unloading systems, vacuum adsorption fixtures, dust separation modules, and pipeline dust removal systems.

Parameters of Copper/Aluminum Substrate Laser Cutting Machines

Applications of Copper/Aluminum Substrate Laser Cutting Machines

Laser cutting machines widely used in industries such as 3C electronics, automotive, semiconductors, aerospace, medical, and industrial manufacturing, including:

Precision cutting and drilling of PCB circuit boards, aluminum/copper substrates, copper-clad substrates, ceramic substrates (silicon nitride, zirconia).

LED heat dissipation substrates, COF (chip-on-film), 5G copper foil antennas, battery connectors, and various metal plates.

Sample Showcase of Laser-Cut Substrates